삼성과 LG의 최신 스마트폰 체험은 물론 신기한 디자인의 웨어러블 디바이스, VR을 활용한 모의 면접, 5G를 활용한 기기 등 다양한 기술을 한 곳에서 체험할 수 있었습니다. 마치 IT 뷔페에 온 것 같은 느낌이랄까요? 물론 상용화된 기술들만 있던 건 아니여서 컨셉 정도만 제시하던 부스도 있고 다소 불안정한 상태로 작동하던 기술들도 있었지만 그래도 미래의 기술들을 조금 먼저 엿볼 수 있다는 건 즐거운 일입니다.
다소 구름이 많았던 목요일 오전. 취재를 위해 코엑스로 향했습니다. 평일임에도 불구하고 많은 인파로 가득했던 월드 IT 쇼 2018, 현장의 생생함을 사진으로 담아봤습니다.
![](https://static.inven.co.kr/column/2018/05/24/news/i15728882222.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15779648063.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i16006145293.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13381717253.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i16584686500.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14780312478.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13757332807.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14360493087.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15948304510.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13168582719.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15674196450.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14661455409.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13818430765.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15285736501.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14325224472.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13133176244.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13137799570.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13184755269.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13169768510.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13119827885.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14648757217.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14693196305.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14646625914.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i16541972901.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i16043102464.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14183736567.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15192676062.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i16439453492.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14045228154.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14094951114.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14055484917.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15128243933.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i15179384463.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i13295904038.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14047583541.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14256514832.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14207977830.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14209555721.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14260527386.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14275109809.jpg)
![](https://static.inven.co.kr/column/2018/05/25/news/i14706415786.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14216579515.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14111115225.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14246686646.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14160119797.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14109885808.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14161798266.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14112821522.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14164144647.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14175290349.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14168703111.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14117349597.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14120481394.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14120482983.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14172496102.jpg)
![](https://static.inven.co.kr/column/2018/05/25/news/i14755186614.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14123499079.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14172676808.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14128597229.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14177576251.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14130213472.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14179835296.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14132107103.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14134369871.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14185892216.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14141343592.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14187174469.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14135119994.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14187665610.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14136905754.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14187977488.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14138274123.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14188715932.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14140940240.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14189416016.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14141793450.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14198864985.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14145445642.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14198119200.jpg)
![](https://static.inven.co.kr/column/2018/05/24/news/i14149528203.jpg)